Infos

However, until recently, a major challenge remained: how to accurately convert the sputtering time into an actual depth measurement, given that the erosion rate varies depending on the layers traversed? This is where the DIP (Differential Interferometric Profiling) accessory, developed and patented (WO15166189A1 & WO18119410A1) by HORIBA's Innovation team, comes in. It is integrated into the latest generation of GD devices